Oxford plasmalab 100 manual

The Oxford Plasmalab 100 inductively coupled plasma (ICP) etcher is a multipurpose fluorocarbon based system that provides users anisotropic etching of silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature controlled electrode to help users tailor their etch feature profiles. The manual load system can accommodate substrates ranging from 200 mm Description. OXFORD PLASMALAB 100 RIE. This is subject to prior sale. This is only for end user. Appreciate your time. Condition: We can sell it at AS IS or COMPLETE,WORKING,FUNCTIONAL TEST . Reactive Ion Etcher (RIE) system. Gases: Ar, CHF3, H2, He, N2, 2 of O2, SF6, SiCl4. Oxford Plasmalab 100 Responsible: Anders Liljeborg, Adrian Iovan Process gases O 2, Ar, CF 4, CHF 3, SF 6, Cl 2. Inductive Coupled Plasma (ICP), Helium backside cooling, temperature controlled electrode. Manufacturers manual (limited access). Suggested process recipes from Oxford Plasma Tech. (limited access). Laser End Point Detection The Oxford Plasmalab 100 is an Inductive Coupled Plasma Reactive Ion Etching (ICP RIE) tool. It is a multipurpose fluorocarbon-based system that provides users anisotropic etching of silicon, silicon oxide, and other dielectric materials. High etch rates are achieved by the presence of high ion and radical densities. Wafer size: up to 4". The Oxford Plasmalab 100 inductively coupled plasma (ICP) etcher is a multipurpose fluorocarbon based system that provides users anisotropic etching of silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature controlled electrode to help users tailor their etch feature profiles. The manual load system can accommodate substrates ranging from 200 mm Oxford Plasma Lab 100. Oxford Plasma Lab 100 Oxford Instruments - Plasmalab System 100 MANTH University of Pennsylvania Singh Center for Nanotechnology Thin Film Processing. Dielectric. PECVD; Description. This is a load locked PECVD system capable of depositing SiO2, Si3N4 and a-Si. OXFORD PLASMALAB 100 ICP SYSTEM consisting of: - Model: Plasmalab 100 ICP - Inductive Coupled Plasma Source (ICP380) - Chuck: 8'/200m, Mechanical Wafer Clamping. ICP-RIE (Oxford Plasmalab 100) Basic User Manual 3rd Edition September 2012, NR. Tom Pennell. Body. The Oxford Plasmalab100 is an inductively coupled plasma based system that is configured for silicon based dielectric etching. The system consists of one ICP process module connected to a single automated wafer transfer load lock. It is equipped with He backside cooling and has a temperature controlled electrode. The PlasmaPro 100 RIE modules deliver isotropic and anisotropic dry etching for an extensive range of processes. It is suitable for research and production customers, providing a controlled environment that improves process repeatability with load-lock and cassette-to-cassette options. Compatible with all wafer sizes up to 200mm. 1. Checking the tool condition 1.1 Reserve the tool using NEMO reservation system and select the recipe that you planning to run. 1.2 Enable the tool in NEMO reservation system /Tool Control and select the recipe that you planning to run. 1.3 If "Red Alert" is shown around the screen, stop and contact cleanroom staff If "Yellow Alert" is shown around the screen, press "Continue" Plasmalab® System100 System Diagrams Works Order No.: 94-220025 Original Instructions Customer: University of Notre Dame oxford-instruments.com Oxford Instrume